电子装联技术 Electronic manufacturing

l 电子芯片晶元制造 Wafer fabrication

l 电子元件封装 Electronic packaging

l 电子元件电路板组装 Electronic ponent assembly

电子元件失效分析 IC ponent failure analysis

l 电子产品为何失效 Why do electronic products fail ?

l 失效分析的目标 The objectives of failure analysis

l 失效分析流程 Failure analysis flow charts

l 常用失效分析工具 tools in IC ponent failure analysis

电子封装失效分析 Electrical package failure analysis

l 典型封装工艺流程 Typical electrical process

l 电子封装典型失效模式 Typical failure mode of electrical package

l 电子封装失效分析方法和工具 Failure analysis flow charts

l 电子元件失效分析复杂度分级 IC ponent failure analysis plexity

l 典型案例 typical case study

组装焊点失效分析 Solder joint failure analysis

l 典型组装工艺流程 Typical SMTA process

l 组装焊点典型失效模式 Typical failure mode of solder joint

l 组装焊点失效分析方法和工具 Solder joint failure analysis

l 典型案例 Typical case study

可靠性、质量认证及测试 Reliability, Qualification and test

l 微电子器件及微系统简介 Brief introduction of microelectronic devices and micro-electronic systems

l 可靠性描述和浴盆曲线 Reliability description and bathtub curve

l 常见可靠性模型和加速因子估算 mon reliability model and active factor estimation

l 可靠性试验和认证 Typical reliability tests

l 器件结构分析 Package construction analysis

电子器件静电防护和过电损伤 ESD and E0S

l 静放电/电过应力基本概念介绍 ESD/E0S definition and distinguish

l 器件/系统静放电评估和实验方法 ponent level ESD while system level ESD evaluation and test

l 静放电控制和检查 Typical ESD control and checklist in manufacture process

l 电过应力预防和根因分析难点 Typical E0S prevention and challenge of root cause identification

l 典型案例 Case study